Summary
Active Offers for Sticker | blameF (Glitter) | Shanghai 2024
Introducing the Sticker | blameF (Holo) | Shanghai 2024, a unique item celebrating the Perfect World Shanghai 2024 CS2 Major Championship. This versatile sticker can be affixed to any weapon in your collection and can be scraped for a worn appearance. You have the option to scrape it multiple times, gradually creating a distressed look until you choose to remove it. This holographic sticker features the autograph of professional player Benjamin Vang Bremer, representing Fnatic at the Perfect World Shanghai 2024 CS2 Major Championship.
The Sticker | blameF (Holo) | Shanghai 2024 was launched in CS2 on November 27, 2024, as part of the Shanghai 2024 Challengers Autograph Capsule, coinciding with the "Shanghai 2024 Stickers" update.
The Sticker | blameF (Holo) | Shanghai 2024 is available by opening a Shanghai 2024 Challengers Autograph Capsule. This item does not belong to any specific collections.
The Sticker | blameF (Holo) | Shanghai 2024 has a popularity rating of 35%, making it one of the less sought-after items in CS2. This rating is determined by daily sales volume and the item's current price.
The Sticker | blameF (Holo) | Shanghai 2024 is part of a collection of 8,847 Sticker items. This Exotic rarity makes the blameF (Holo) | Shanghai 2024 a highly sought-after item, with an estimated drop chance of just 3.2%.
The Sticker | blameF (Holo) | Shanghai 2024 is priced at just $0.31, making it a budget-friendly choice. It's readily available across various markets for easy purchase.
Introducing the Sticker | blameF (Holo) | Shanghai 2024, part of the 2024 PW Shanghai CS2 Championship. This exclusive sticker represents the Fnatic team and honors the player blameF (Benjamin Vang Bremer). Grab yours now!
This Sticker | blameF (Holo) | Shanghai 2024 features a unique "Holo" film. Holo stickers include an additional texture layer that produces a stunning holographic effect. While they aren't extremely rare, their popularity can drive up their price.
